In the precision field of semiconductor packaging, conductive glue and insulating glue are not only the medium of connecting and protection, but also the key elements of high -performance and high reliability.These two types of rubber materials play an irreplaceable role in the high -efficiency transmission and environmental isolation of electronic signals through their unique performance.
1. Conductive gum: current bridge between micrometers
basic concept
Conductive glue is a adhesive containing conductive fillers (such as metal powder, carbon nanotubes, etc.). It can form a conductive path between two electronic components while maintaining a certain mechanical strength and adhesion.It is widely used in the fields of micro -electrical packaging, printing circuit board assembly, sensor manufacturing.
Key features
Conductivity: According to application needs, adjust the proportion and type of conductive filler to achieve specific resistance.
Heat stability: Maintain stable performance in a return welding or high -temperature working environment.
Adhesive intensity: ensure the reliability and persistence of electrical connection under mechanical stress.
Applicability: Good adhesion on different substrates (such as metal, ceramics, plastic).
2. Insulation: The guardian of the interference isolates interference
basic concept
Insulation glue is used to isolate unnecessary current conduction between electronic components to prevent short circuit, while providing mechanical support and environmental sealing.It plays an important role in protecting sensitive electronic components and improving packaging reliability.
Key features
High insulation: Make sure that the current can be effectively prevented from leakage under various conditions.
Thermal expansion coefficient: match the packaging material to reduce the stress during thermal cycle.
Chemical resistance: chemical corrosion that may encounter during the discharge process or in the environment.
Flexibility and durability: Adapt to packaging requirements of different shapes and sizes, and maintain stable performance for a long time.
3. Application practice and challenge
Precision point glue technology: The use of high -precision point glue equipment to ensure the precise application of conductive glue and insulating glue in a small space is the key to achieving high -performance packaging.
Material compatibility: Choose a glue compatible with chips and substrate materials to avoid chemical reactions in long -term use and lead to decline in performance.
Environmental adaptability: For different application scenarios (such as high temperature, high humidity, strong earthquake, etc.), optimize the formula of rubber materials and improve the overall durability of packaging parts.
4.future trends and technological innovation
Application of nanotechnology: Using nanomaterials to improve the conductivity or insulation performance of the colloid, while reducing volume and adapting to smaller packaging size.
Self -healing materials: Study conductive glue and insulation glue with self -repairing function, and improve the long -term reliability of packaging parts.
The development of environmental protection materials: respond to global environmental trends, develop low -toxic and recyclable glue materials, and reduce the impact on the environment.
Conductive glue and insulating glue play a vital role in semiconductor packaging technology. They not only have the performance of electronic products, but also an important force to promote the innovation of packaging technology.With the continuous progress of technology and the increasingly diverse market demand, the continuous optimization and innovation of these two types of materials will be an important issue in the field of semiconductor packaging in the future.
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